ACID TIN PLATING
Process | Compositions& Operating Conditions | Applications & Features | |
STANNOLITE | Stannous Sulphate Sulphuric acid (C.P or L.R) Stannolite carrier - 670 Stannolite brightener - 671 Temperature Cathode Current Agitation |
30-40 gm/l 100-110 ml/l 30 - 35ml/l 4-5 ml/l room 1-4 A/dm² Cathode rod |
Produces exceptionally bright tin deposit with tarnish and corrosion resistance. Used in artificial jewellery and resist coating for PCB thru hole plating has very good soldering and current conducting properties. |
SATIN TIN PLATING
Process | Compositions& Operating Conditions | Applications & Features | |
SATIN TIN SALT | Concentration |
100-150 g/l |
Produces a dull tin plating. Mainly used to achieve thick coatings. |
ELECTROLESS TIN
Process | Compositions& Operating Conditions | Applications & Features | |
ELECTROLESS TIN | Concentration Part A- |
50-100 ml/l |
Produces an electroless tin coating on copper & copper alloys very good for electrical & electronic parts. |